- All sections
- C - Chemistry; metallurgy
- C09G - Polishing compositions; ski waxes
- C09G 1/02 - Polishing compositions containing abrasives or grinding agents
Patent holdings for IPC class C09G 1/02
Total number of patents in this class: 1936
10-year publication summary
|
151
|
154
|
158
|
161
|
187
|
212
|
200
|
188
|
187
|
53
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Fujimi Incorporated | 676 |
263 |
| CMC Materials LLC | 254 |
119 |
| Anji Microelectronics (Shanghai) Co., Ltd. | 169 |
118 |
| Resonac Corporation | 2233 |
93 |
| Versum Materials US, LLC | 591 |
76 |
| Rohm and Haas Electronic Materials CMP Holdings, Inc. | 309 |
73 |
| BASF SE | 19740 |
69 |
| FUJIFILM Electronic Materials U.S.A., Inc. | 270 |
65 |
| Cabot Microelectronics Corporation | 219 |
53 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
45 |
| Saint-Gobain Ceramics & Plastics, Inc. | 812 |
36 |
| K.C. Tech Co., Ltd. | 78 |
32 |
| JSR Corporation | 2476 |
30 |
| Anji Microelectronics Technology (Shanghai) Co., Ltd. | 45 |
29 |
| Entegris, Inc. | 1736 |
27 |
| BASF (China) Co., Ltd. | 755 |
27 |
| FUJIFILM Corporation | 27102 |
24 |
| Shin-Etsu Chemical Co., Ltd. | 5132 |
23 |
| CMC Materials, Inc. | 33 |
22 |
| Kao Corporation | 4843 |
21 |
| Other owners | 691 |